Utilizing a SemiCorp Model 850 Flip Chip Placement System, substrate bonding with a nominal accuracy of +/- 12 microns can be achieved. The integration of a heated stage in this system allows for the use of a wide variety of adhesives. Our flip chip bonding capability enables our engineers to precisely align and bond substrates prior to subsequent downstream processing, such as wire bonding, housing, or other packaging steps.
A K&S 4524D Digital Wire Bonder facilitates the connecting of die elements to chip circuitry. Comprehensive controllable bond settings make wiring between a variety of substrates is possible. The availability of our in-house wire bonding tool allows our team to quickly assemble R&D prototypes, as well as manufacture small batches of commercial products.
Following alignment and bonding, the housing of die into assemblies is often a challenging yet critical step in the fabrication of a product. IC2 is able to assist clients in the design and manufacture of robust housing products and protocols for sensitive and delicate devices.