Selected Publications

Access in-depth technical articles on sensing technology

Below you will find many of our conference papers, presentations, and pre-print editions of journal articles.  Some of these are now available for download.

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Shear Stress Sensors

  • D. Mills, W. Patterson, C. Keane, M. Sheplak, "Characterization of a Fully-Differential Capacitive Wall Shear Stress Sensor for Low-Speed Wind Tunnels", 56th AIAA Aerospace Sciences Meeting, AIAA SciTech, AIAA Paper 2018-0301, Kissimmee, FL, Jan 8-12, 2018.  (Paper/Presentation)
  • D. Mills, C. Barnard, and M. Sheplak, "Characterization of a Hydraulically Smooth Wall Shear Stress Sensor for Low-Speed Wind Tunnel Applications," 55th AIAA Aerospace Sciences Meeting, AIAA SciTech, AIAA Paper 2017-0478, Grapevine, TX, January 9-13, 2017. (Paper/Presentation)
  • D. Mills, C. Barnard, S. Horowitz, M. Sheplak, "Hydraulically-Smooth Wall Shear Stress Sensors for Direct Measurement of Mean and Fluctuating Skin Friction", 2017 ITEA Test Technology Review, Huntsville, AL, Nov 15, 2017. 
  • D. Mills, D. Blood, and M. Sheplak, “Characterization of a sapphire optical wall shear stress sensor for high-temperature applications,” 54th AIAA Aerospace Sciences Meeting, AIAA SciTech, AIAA Paper 2016-2016, San Diego, CA, January 4-8, 2016. (Paper/Presentation)
  • D. Mills, S. Horowitz, T. Chen, and M. Sheplak, “Sapphire Micromachined Wall Shear Stress Sensors for High-Temperature Skin-Friction Measurements”, presented at 20th Test Instrumentation Workshop (ITEA), Las Vegas, NV, May 10-12, 2016. (Presentation)
  • T. Chen, C. Barnard, D. Mills, S. Horowitz, M. Sheplak, "Instrumentation-Grade Shear Stress Sensors for Direct Measurement of Mean and Fluctuating Skin Friction", presented at 20th Test Instrumentation Workshop (ITEA), Las Vegas, NV, May 10-12, 2016. 
  • C. Barnard, D. Mills, J. Meloy and M. Sheplak, "Development of a Hydraulically Smooth Wall Shear Stress Sensor Utilizing Through Silcon Vias", presented at Hilton Head Workshop 2016: A Solid-State Sensors, Actuators and Microsystems Workshop, Hilton Head, SC, June 5-9, 2016. 
  • D. Mills, D. Blood, and M. Sheplak, “Development of a sapphire optical wall shear stress sensor for high-temperature applications,” in Digest Tech. Papers Transducers ’15 Conference, Anchorage, AK, June 21-25, 2015, pp. 1295-1298.
  • T. Chen, D. Mills, V. Chandrasekharan, and M. Sheplak, "A miniaturized optical package for wall shear stress measurements in harsh environments", SPIE 9113, Sensors for Extreme Harsh Environments, 91130G, 4 June 2014
  • J. Meloy, J. Sells, V. Chandrasekharan, J. Griffin, L. Cattafesta, D. P. Arnold, and M. Sheplak,“Experimental verification of a capacitive shear stress sensor for low-speed wind tunnel applications”, Hilton Head 2012, Hilton Head Island, SC, 06/2012.
  • M. Rueff, T. Schmitz, B. A. Griffin, D. Mills, and M. Sheplak, “Evaluation of Optical Fiber Positioning using Silicon V-Grooves”, 39th North American Manufacturing Research Conference, Corvallis, OR, 2011.
  • V. Chandrasekharan, J. Sells, J. Meloy, D. P. Arnold, and M. Sheplak, “A Microscale Differential Capacitive Direct Wall-Shear-Stress Sensor”, Journal of Microelectromechanical Systems, vol. 20, no. 3, 06/2011.
  • J. Sells, V. Chandrasekharan, J. Meloy, M. Sheplak, H. Zmuda, and D. P. Arnold, “Microfabricated silicon-on-Pyrex passive wireless wall shear stress sensor”, 2011 IEEE Sensors2011 IEEE SENSORS Proceedings, Limerick, Ireland, IEEE, pp. 77 – 80, 2011.
  • J. Meloy, J. Griffin, J. Sells, V. Chandrasekharan, L. Cattafesta, and M. Sheplak, “Experimental Verification of a MEMS Based Skin Friction Sensor for Quantitative Wall Shear Stress Measurement”, 41st AIAA Fluid Dynamics Conference and Exhibit, AIAA 2011-3995, Honolulu, Hawaii, 06/2011. (Paper)
  • D, Blood, D. Mills, M. Sheplak, and T. Schmitz, “Picosecond Laser Ablation of Sapphire for High Temperature Sensor Fabrication”, Technologies for Future Micro-Nano Manufacturing Workshop, Napa, CA, Transducers Research Foundation, 08/2011.
  • B. Griffin, D. Mills, T. Schmitz, and M. Sheplak, “Sapphire Sensors for High Temperature Applications”, Florida Center for Advanced Aero-Propulsion Annual Technical Symposium, Tallahassee, FL, 08/2010.
  • J. Sells, V. Chandrasekharan, H. Zmuda, M. Sheplak, and D. P. Arnold, “Passive Wireless Direct Shear Stress Measurement”, Solid-State Sensors, Actuators, and Microsystems Workshop, Hilton Head, SC, pp. 368-371, 06/2010.
  • T. Chen, D. Mills, V. Chandrasekharan, H. Zmuda, and M. Sheplak, “Optical Miniaturization of a MEMS-Based Floating Element Shear Stress Sensor with Moire”, 48th AIAA Aerospace Sciences Meeting, AIAA Paper 2010-0498, 01/2010. (Paper)
  • V. Chandrasekharan, J. Sells, D. P. Arnold, and M. Sheplak, “Effect of dynamic pressure on direct shear stress sensor design”, 48th AIAA Aerospace Sciences Meeting, AIAA Paper 2010-004, 01/2010. (Paper)
  • V. Chandrasekharan, J. Naughton, and M. Sheplak, “Shear Stress Measurements”,Encyclopedia of Aerocpace Engineering, 1, vol. 1, 2010.
  • V. Chandrasekharan, J. Sells, J. Meloy, D. P. Arnold, and M. Sheplak, “A MEMS Direct Skin Friction Sensor”, Florida Center for Advanced Aero-Propulsion, FCAAP Annual Symposium and Exhibition, 08/2010.
  • V. Chandrasekharan, J. Sells, J. Meloy, D. P. Arnold, and M. Sheplak, “A Metal-On-Silicon Differential Capacitive Shear Stress Sensor”, Tech. Dig. 15th Int. Conf. Solid-State Sensors, Actuators, and Microsystems (Transducers 2009), Denver, CO, June, 2009.
  • V. Chandrasekharan, J. Sells, D. P. Arnold, and M. Sheplak, “Characterization of a MEMS-Based Floating Element Shear Stress Sensor”, 47th AIAA Aerospace Sciences Meeting and Exhibit, AIAA Paper 2009-316, Orlando, FL, 01/2009.
  • B. Griffin, M. Sheplak, and T. Schmitz, “High Temperature Direct Shear Stress and Pressure Sensors”, NEMS/MEMS Workshop at Redstone Arsenal, Huntsville, AL, 09/2009.
  • Y. Li, V. Chandrasekharan, B. Bertolucci, T. Nishida, L. Cattafesta, and M. Sheplak, “A MEMS Shear Stress Sensor for Turbulence Measurements”, 46th AIAA Aerospace Sciences Meeting and Exhibit, AIAA-2008-269, Reno, Nevada, January, 2008.
  • Y. Li, T. Nishida, D. P. Arnold, and M. Sheplak, “Microfabrication of a wall shear stress sensor using side-implanted piezoresistive tethers”, Proceeding of SPIE 14th Annual International Symposium on Smart Structures and Materials, Paper No.6529-13, San Diego, CA, May, 2007.
  • Y. Li, M. Papila, T. Nishida, L. Cattafesta, and M. Sheplak, “Modeling and optimization of a side-implanted piezoresistive shear stress sensor”, Proceeding of SPIE 13th Annual International Symposium on Smart Structures and Materials, Paper 6174-7, San Diego, CA, February, 2006.
  • V. Chandrasekaran, A. Cain, T. Nishida, L. Cattafesta, and M. Sheplak, “Dynamic calibration technique for thermal shear-stress sensors”, Experiments in Fluids, vol. 38, pp. 56-65, JUL, 2005.
  • J. Chao, W. Shyy, S. Thakur, M. Sheplak, and R. Mei, “Effect of Conjugate Heat Transfer on MEMS-Based Thermal Shear Stress Sensor”, Numerical Heat Transfer-A, vol. 48, no. 3, pp. 197-217, AUG, 2005.
  • S. Horowitz, T-A. Chen, V. Chandrasekaran, K. Tedjojuwono, T. Nishida, L. Cattafesta, and M. Sheplak, “A Wafer-Bonded, Floating Element Shear-Stress Sensor”, Solid State Sensor, Actuator and Microsystems Workshop, Hilton Head, SC, pp. 13-18, June, 2004.
  • M. Sheplak, L. Cattafesta, and T. Nishida, “MEMS Shear Stress Sensors: Promise and Progress”, 24th AIAA Aerodynamic Measurement Technology and Ground Testing Conference, AIAA 2004-2606 (invited), Portland, OR, June, 2004. (Paper)
  • S. Horowitz, T-A. Chen, L. Cattafesta, M. Sheplak, T. Nishida, and V. Chandrasekaran, “Optical Flow Sensor Using Geometric Moire Interferometry”, 34th International Conference on Environmental Systems, SAE Paper 2004-01-2267, Colorado Springs, CO, July, 2004.
  • S. Horowitz, T-A. Chen, V. Chandrasekaran, K. Tedjojuwono, T. Nishida, L. Cattafesta, and M. Sheplak, “A Micromachined Geometric Moire Interferometric Floating-Element Shear Stress Sensor”, 42nd Aerospace Sciences Meeting and Exhibit, AIAA Paper 2004-1042, Reno, NV, January, 2004. (Paper/Presentation)
  • A. Appukuttan, W. Shyy, M. Sheplak, and L. Cattafesta, “Mixed Convection Induced by MEMS-Based Thermal Shear Stress Sensors”, Numerical Heat Transfer-A, vol. 43, no. 3, pp. 283-305, JUL, 2003.
  • M. Sheplak, A. Cain, T. Nishida, and L. Cattafesta, “Characterization of a Micromachined Thermal Shear Stress Sensor”, AIAA Journal, vol. 40, no. 6, pp. 1099-1104, APR, 2002.
  • J. Naughton, and M. Sheplak, “Modern Developments in Shear Stress Measurement”,Progress in Aerospace Sciences, vol. 38, pp. 515-570, JUL, 2002.
  • V. Chandrasekaran, A. Cain, T. Nishida, L. Cattafesta, and M. Sheplak, “Characterization of a Micromachined Thermal Shear Stress Sensor”, 39th AIAA Aerospace Sciences Meeting & Exhibit, AIAA Paper 2001-0247, Reno, NV, January, 2001.
  • M. Sheplak, A. Padmanabhan, M. Schmidt, and K. Breuer, “Dynamic Calibration of a Shear Stress Sensor using Stokes Layer Excitation”, AIAA Journal, vol. 39, issue 5, no. 5, pp. 819-823, JUN, 2001.
  • J. Naughton, and M. Sheplak, “Modern Skin Friction Measurement Techniques: Description, Use, and What to Do with the Data”, 21st AIAA Advanced Measurement Technology and Ground Testing Conference, AIAA Paper 2000-2521, Denver, CO, June, 2000.
  • V. Chandrasekaran, A. Cain, T. Nishida, and M. Sheplak, “Dynamic Calibration Technique for Thermal Shear Stress Sensors with Variable Mean Flow”, 38th AIAA Aerospace Sciences Meeting & Exhibit, AIAA Paper 2000-0508, Reno, NV, January, 2000.
  • M. Sheplak, A. Padmanabhan, M. Schmidt, and K. Breuer, “Dynamic Calibration of a Shear-Stress Sensor Using Stokes Layer Excitation”, 36th AIAA Aerospace Sciences Meeting & Exhibit, AIAA Paper 98-0585, Reno, NV, January, 1998. (Paper)
  • M. Sheplak, A. Padmanabhan, M. Schmidt, S. Lee, and K. Breuer, “Dynamic Calibration of a Shear-Stress Sensor by Acoustic Waves”, 49th Annual Meeting of APS Division of Fluid Dynamics, Syracuse, NY, NOV, 1996.
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Microphones

  • M. Williams, B. A. Griffin, T. N. Reagan, J. R. Underbrink, and M. Sheplak, “Characterization of Aeroacoustic MEMS Microphones for Aircraft Fuselage Arrays”, AIAA Journal, vol. 50, pp. 2744-2752, 12/2012.
  • B. Homeijer, B. A. Griffin, M. D. Williams, B. V. Sankar, and M. Sheplak, “Composite Circular Plates with Residual Tensile Stress Undergoing Large Deflections”, Journal of Applied Mechanics, vol. 79, no. 2: ASME, 03/2012.
  • S. Horowitz,  J. Fox, D. Mathias, J. Cortes, M. Allen, L. Barkett, M. Sanghadasa, “Miniaturized Nanocomposite Piezoelectric Microphones for UAS Applications,” presented at SENSIAC – 2012 Joint Meeting of the Military Sensing Symposia (MSS) Specialty Groups on Battlespace Acoustic, Seismic, Magnetic, and Electric-Field Sensing and Signatures (BAMS), Washington, DC, Oct. 22-25, 2012.
  • S. Horowitz, D. Mathias, J. Fox, J. Cortes, M. SanghadasaP. Ashley,  “Effects of Scaling and Geometry on the Performance of Piezoelectric Microphones,” Sensors and Actuators A: Physical, Vol. 185, pg. 24-32, 2012.
  • M. Williams, B. A. Griffin, T. N. Reagan, J. R. Underbrink, and M. Sheplak, “An AlN MEMS Piezoelectric Microphone for Aeroacoustic Applications”, Journal of Microelectromechanical Systems, vol. 21, no. 2, 04/2012.
  • A. Edstrand, C. Bahr, M. D. Williams, J. Meloy, T. N. Reagan, D. Wetzel, M. Sheplak, and L. Cattafesta, "An Aeroacoustic Microelectromechanical Systems (MEMS) Phased Microphone Array", 5aEA15, vol. 129, no. 4, pp. 2645, May, 2011.
  • M. Williams, B. A. Griffin, J. Meloy, and M. Sheplak, “A microelectromechanical systems-based piezoelectric microphone for aeroacoustic measurements”, 2nd Pan-American/Iberian Meeting on Acoustics, Cancun, Mexico, Acoustical Society of America, 11/2010.
  • M. Williams, B. A. Griffin, A. Ecker, J. Meloy, and M. Sheplak, “An Aluminum Nitride Piezoelectric Microphone for Aeroacoustics Applications”, Hilton Head 2010: A Solid-State Sensors, Actuators, and Microsystems Workshop, Hilton Head, SC, Transducer Research Foundation, Inc., 06/2010.
  • B. Griffin, D. Mills, T. Schmitz, and M. Sheplak, "Fabrication and characterization of a sapphire based fiber optic microphone for harsh environments", Cancun, Mexico, presentation at the 2nd Pan American/Iberian Meeting on Acoustics, 11/2010.
  • D. Martin, K. Kadirvel, T. Nishida, and M. Sheplak, “An Instrumentation Grade MEMS Condenser Microphone for Aeroacoustic Measurements”, 46th AIAA Aerospace Sciences Meeting and Exhibit, AIAA-2008-257, January, 2008.
  • J. Liu, D. Martin, T. Nishida, L. Cattafesta, M. Sheplak, and B. Mann, “Harmonic Balance Nonlinear Identification of a capacitive dual-backplate MEMS microphone”, J. Microelectromechanical Systems, vol. 17, no. 3, pp. 698-708, JUN, 2008.
  • M. Papila, M. Sheplak, and L. Cattafesta, “Optimization of Clamped Circular Piezoelectric Composite Actuators”, Sensors & Actuators A, vol. 147, no. 1, pp. 310-323, SEP, 2008.
  • B. Griffin, B. Homeijer, M. D. Williams, B. V. Sankar, and M. Sheplak, “Large Deflections of Clamped Composite Circular Plates with Initial In-Plane Tension”, IMAC XXVI, A Conference and Exposition on Structural Dynamics, Orlando, FL, February, 2008.
  • J. Liu, D. Martin, K. Kadirvel, T. Nishida, L. Cattafesta, M. Sheplak, and B. Mann, “Nonlinear Model and System Identification of a Capacitive Dual-Backplate MEMS Microphone”, J. Sound Vib., vol. 309, no. 1-2, pp. 276-292, JAN, 2008.
  • D. Martin, K. Kadirvel, T. Nishida, and M. Sheplak, “A Surface Micromachined Capacitive Microphone for Aeroacoustic Applications”, Solid-State Sensor, Actuator and Microsystems Workshop, Hilton Head, SC, June, 2008.
  • B. Homeijer, L. Cattafesta, T. Nishida, and M. Sheplak, “Design of a MEMS Piezoresistive Microphone for use in Aeroacoustic Measurements”, 13th AIAA/CEAS Aeroacoustics Conference and Exhibit, Rome, Italy, May, 2007.
  • D. Martin, J. Liu, K. Kadirvel, R. M. Fox, M. Sheplak, and T. Nishida, “A Micromachined Dual-Backplate Capacitive Microphone for Aeroacoustic Measurements”, J. Microelectromechanical Systems, vol. 16, no. 6, pp. 1289-1302, DEC, 2007.
  • S. Horowitz, T. Nishida, L. Cattafesta, and M. Sheplak, “Development of a micromachined piezoelectric microphone for aeroacoustics applications”, J. Acoust. Soc. Am., vol. 122, no. 6, pp. 3428-3436, DEC, 2007.
  • K. Kadirvel, D. Martin, J. Liu, R. M. Fox, M. Sheplak, L. Cattafesta, and T. Nishida, “Design, Modeling and Simulation of a Closed-Loop Controller for a Dual Backplate MEMS Capacitive Microphone”, 6th IEEE Conference on Sensors, Atlanta, GA, pp. 87-90, October, 2007.
  • M. Williams, B. A. Griffin, B. Homeijer, B. V. Sankar, and M. Sheplak, “Vibration of Post-Buckled Homogeneous Circular Plates”, IEEE Ultrasonics Symposium, 2007: IEEE, October, 2007.
  • M. Williams, B. A. Griffin, B. Homeijer, B. V. Sankar, and M. Sheplak, “The Nonlinear Behavior of a Post-Buckled Circular Plate”, 6th IEEE Conference on Sensors, October, 2007.
  • S. Horowitz, T. Nishida, L. Cattafesta, and M. Sheplak, “A Micromachined Piezoelectric Microphone for Aeroacoustics Applications”, Solid-State Sensor, Actuator and Microsystems Workshop, Hilton Head, SC, June, 2006.
  • J. Liu, M. Sheplak, and B. Mann, “Pull-In Instability and Shock Load Response of a MEMS Dual-Backplate Capacitive Microphone”, 43rd Annual Technical Meeting of the Society of Engineering Science (SES 06), State College, PA, AUG, 2006.
  • M. Papila, R. T. Haftka, T. Nishida, and M. Sheplak, “Piezoresistive Microphone Design Pareto Optimization: Tradeoff between Sensitivity and Noise Floor”, J. Microelectromechanical Systems, vol. 15, no. 6, pp. 1632-1643, DEC, 2006.
  • B. Homeijer, B. A. Griffin, T. Nishida, L. Cattafesta, and M. Sheplak, “Design and Optimization of a MEMS Piezoresistive Microphone for use in Aeroacoustic Measurements”,  presentation at the 4th Joint Meeting of the ASA and ASJ, Honolulu, HI, DEC, 2006.
  • S. Prasad, Q. Gallas, S. Horowitz, B. Homeijer, B. V. Sankar, L. Cattafesta, and M. Sheplak, “An Analytical Electroacoustic Model of a Piezoelectric Composite Circular Plate”, AIAA Journal, vol. 44, no. 10, pp. 2311-2318, OCT, 2006.
  • T. Nishida, R. Dieme, M. Sheplak, and G. Bosman, “Noise Modeling and Characterization of Piezoresistive Transducers”, Proceedings of ASME International Mechanical Engineering Congress and Exposition, Paper IMECE2006-15392, November, 2006.
  • D. Martin, J. Liu, K. Kadirvel, R. M. Fox, M. Sheplak, and T. Nishida, “Development of a MEMS Dual Backplate Capacitive Microphone for Aeroacoustic Measurements”, 44th AIAA Aerospace Sciences Meeting and Exhibit, AIAA Paper 2006-1246, Reno, NV, January, 2006.
  • R. Dieme, G. Bosman, M. Sheplak, and T. Nishida, “Source of Excess Noise in Silicon Piezoresistive Microphones”, J. Acoustical Society of America, vol. 119, pp. 2710-2720, MAY, 2006.
  • J. Liu, D. Martin, K. Kadirvel, T. Nishida, L. Cattafesta, M. Sheplak, and B. Mann, “Nonlinear System Identification of a MEMS Dual-Backplate Capacitive Microphone by Harmonic Balance Method”, 2005 ASME International Mechanical Engineering Congress and Exposition, Paper IMECE2005-82880, Orlando, FL, November, 2005.
  • D. Martin, K. Kadirvel, J. Liu, R. M. Fox, M. Sheplak, and T. Nishida, “Surface and Bulk Micromachined Dual Back-Plate Condenser Microphone”, 18th IEEE International Conference on Micro Electro Mechanical Systems (MEMS 2005), Miami, FL, January, 2005.
  • J. Liu, D. Martin, K. Kadirvel, T. Nishida, M. Sheplak, and B. Mann, “Nonlinear Identification of a Capacitive Dual-Backplate MEMS Microphone”, 2005 ASME International Design Engineering Technical Conferences, Paper DETC2005-84591, Long Beach, CA, September, 2005.
  • D. Martin, J. Liu, K. Kadirvel, R. M. Fox, M. Sheplak, and T. Nishida, “Dual-Backplate Capacitive Aeroacoustic Microphone”, 150th Meeting of the Acoustical Society of America, Minneapolis, MN, OCT, 2005.
  • B. Griffin, B. Homeijer, V. Chandrasekaran, B. V. Sankar, and M. Sheplak, “A Nonlinear Model for the Large Deflections and Buckling of Circular Composite Diaphragms”, 2005 ASME International Mechanical Engineering Congress & Exposition, November, 2005.
  • S. Horowitz, T. Nishida, L. Cattafesta, and M. Sheplak, “Design and Characterization of a Micromachined Piezoelectric Microphone”, 11th AIAA/CEAS Aeroacoustics Conference, AIAA Paper 2005-2998, May, 2005.
  • K. Kadirvel, R. Taylor, S. Horowitz, W. Hunt, M. Sheplak, and T. Nishida, “Design and Characterization of a MEMS Optical Microphone”, 42nd Aerospace Sciences Meeting and Exhibit, AIAA Paper 2004-1030, Reno, NV, January, 2004.
  • R. Dieme, G. Bosman, M. Sheplak, and T. Nishida, “Sources of Excess Noise in Silicon Piezoresistive Microphones”, 148th Meeting Acoustical Society of America, San Diego, CA, NOV, 2004.
  • M. Papila, R. T. Haftka, T. Nishida, and M. Sheplak, “Piezoresistive Microphone Design Pareto Optimization: Tradeoff Between Sensitivity and Noise Floor”, 44th AIAA/ASME/ASCE/AHS Structures, Structural Dynamics, and Materials Conference, AIAA Paper 2003-1632, Norfolk, VA, April, 2003.
  • D. Arnold, T. Nishida, L. Cattafesta, and M. Sheplak, “A directional acoustic array using silicon micromachined piezoresistive microphones”, J. Acous. Soc. Amer., vol. 113, no. 1, pp. 289-298, JAN, 2003.
  • V. Chandrasekaran, M. Sheplak, L. Cattafesta, and B. V. Sankar, “Thermoelastic Actuation: Solution for Circular Composite Plates with Application in MEMS”, International Mechanical Engineering Congress and Exposition, ASME Paper IMECE2002-39334, New Orleans, LA, November, 2002.
  • D. Arnold, T. Nishida, L. Cattafesta, and M. Sheplak, “MEMS-Based Acoustic Array Technology”, 40th Aerospace Sciences Meeting and Exhibit, AIAA Paper 2002-0253, Reno, NV, January, 2002.
  • D. Arnold, T. Nishida, L. Cattafesta, and M. Sheplak, “Technology Development for Directional Acoustic Arrays”, 142nd Meeting of the Acoustical Society of America, Ft. Lauderdale, FL, DEC, 2001.
  • S. Bhardwaj, M. Sheplak, and T. Nishida, “S/N Optimization and Noise Considerations for Piezoresistive Microphones”, 16th International Conference on Noise in Physical Systems and 1/f Fluctuations, Gainesville, FL, World Scientific, pp. 549-552, October, 2001.
  • D. Arnold, S. Bhardwaj, S. Gururaj, T. Nishida, and M. Sheplak, “A Piezoresistive Microphone for Aeroacoustic Measurements”, Proc. of ASME IMECE 2001, International Mechanical Engineering Congress and Exposition, Paper MEMS-23841, vol. 2, New York, NY, November, 2001.
  • R. Saini, S. Bhardwaj, T. Nishida, and M. Sheplak, “Scaling Relations for Piezoresistive Microphones”, International Mechanical Engineering Congress and Exposition, Orlando, FL, November, 2000.
  • M. Sheplak, and J. Seiner, “A MEMS Microphone for Aeroacoustics Measurements”, 37th AIAA Aerospace Sciences Meeting & Exhibit, AIAA Paper 99-0606, Reno, NV, January, 1999.
  • M. Sheplak, and J. Dugundji, “Large Deflections of Clamped Circular Plates Under Tension and Transitions to Membrane Behavior”, J. Appl. Mech., vol. 65, no. 1, pp. 107-115, JUN, 1998.
  • M. Sheplak, K. Breuer, and M. Schmidt, “A Silicon Micromachined Microphone for Aeroacoustics Measurements”, 51st Annual Meeting of APS Division of Fluid Dynamics, Philadelphia, PA, NOV, 1998.
  • M. Sheplak, and J. Dugundji, “Large Deflections of Clamped Circular Plates Under Tension and Transitions to Membrane Behavior”, Thirteenth U.S. National Congress of Applied Mechanics, Gainesville, FL, JUN, 1998.
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Pressure Sensors

  • D. Mills, D. A., Blood, D., Collins, J., Sheplak, M., and Oates, W., “High Temperature, Optical Sapphire Pressure Sensors for Hypersonic Vehicles” Technical Meeting for FAA Center of Excellence for Commercial Space Transportation (COE CST), Boulder, CO, November 2011.
  • B. Griffin, D. Mills, T. Schmitz, and M. Sheplak, “A Sapphire Based Fiber Optic Dynamic Pressure Sensor for Harsh Environments: Fabrication and Characterization”, 49th AIAA Aerospace Sciences Meeting, AIAA-2011-1098, Orlando, FL, AIAA, 01/2011.