IC2 Blog

IC2 Receives Patent for Sensor Backside Wire Bonding

IC2 recently received US Patent #10,461,239 titled "Microscale Sensor Structure with Backside Contacts and Packaging of the Same" for our breakthroughs in sensor packaging. VP of Engineering David Mills led this research and implemented the...

IC2 Welcomes Philip Fournier as MEMS Fabrication Engineer

IC2 is pleased to announce our most recent addition to the MEMS fabrication team, Philip Fournier.  Philip, who joined us this past summer, is our first dedicated fabrication process engineer. Philip's background in semiconductor processing...